Junior RF Design Engineer
- Recruiter
- Anonymous
- Location
- Cambridge
- Salary
- 30000.00 - 40000.00 GBP Annual + Excellent Benefits
- Posted
- 08 Dec 2016
- Closes
- 23 Dec 2016
- Sectors
- Engineering, Design
- Contract Type
- Permanent
- Hours
- Full Time
A growing specialist business is seeking a Junior RF Design Engineer with microwave power amplifiers using ideally GaN discrete transistors.
Our client offers flexible working benefits, working in a highly focussed and professional environment.
Should you possess additional skills, our client would would very interested in hearing from you.
• Monolithic Microwave Integrated Circuit (MMIC)
• Gallium Nitride (GaN)
• Gallium Arsenide (GaAs)
• High efficiency power amplification (PHEMT and HBT)
• Si RFIC or Microwave PCB/MIC
• Multi carrier Modulation (MCM)
• Single Mode Fibre RF (SMF)
• High Density Interconnect (HDI) FR4 Digital Signals
• Low Temperature Co-fired Ceramics (LTCC)
• Microwave Power Amplifier
• Microwave and mm wave sub systems
• ADS software would be an added benefit
• Surface Mount Technology (SMT)
Would be a positive advantage if you have exposure in communication system design with IC packaging technology, RFOW, solid state microwave design, component with low noise VCO/PLL/Synthesiser design and/or digital modulation schemes
Our client offers flexible working benefits, working in a highly focussed and professional environment.
Should you possess additional skills, our client would would very interested in hearing from you.
• Monolithic Microwave Integrated Circuit (MMIC)
• Gallium Nitride (GaN)
• Gallium Arsenide (GaAs)
• High efficiency power amplification (PHEMT and HBT)
• Si RFIC or Microwave PCB/MIC
• Multi carrier Modulation (MCM)
• Single Mode Fibre RF (SMF)
• High Density Interconnect (HDI) FR4 Digital Signals
• Low Temperature Co-fired Ceramics (LTCC)
• Microwave Power Amplifier
• Microwave and mm wave sub systems
• ADS software would be an added benefit
• Surface Mount Technology (SMT)
Would be a positive advantage if you have exposure in communication system design with IC packaging technology, RFOW, solid state microwave design, component with low noise VCO/PLL/Synthesiser design and/or digital modulation schemes